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FMS2023
DC-20 GHZ MMIC LOW LOSS SPST ABSORPTIVE SWITCH
FEATURES:
* * * * * Low insertion loss: 1 dB at 20 GHz High isolation: 50 dB at 20 GHz Absorptive output in off-state Excellent low control voltage performance Available in die form
Pre-Production Datasheet v3.0
FUNCTIONAL SCHEMATIC:
RFin
RFout
GENERAL DESCRIPTION:
The FMS2023 is a low loss high isolation broadband single-pole-single-throw Gallium Arsenide switch, designed on the FL05 0.5m switch process from Filtronic. It offers absorptive properties from the output (50 Ohms termination). This process technology offers leading-edge performance optimised for switch applications. The FMS2023 is developed for the broadband communications, instrumentation and electronic warfare markets.
V1 V2
TYPICAL APPLICATIONS:
* * * * Broadband communications Test Instrumentation Fibre Optics Electronic warfare (ECM, ESM)
ELECTRICAL SPECIFICATIONS (SMALL-SIGNAL UNLESS OTHERWISE STATED):
PARAMETER CONDITIONS
DC 5 GHz 10 GHz 15 GHz 20 GHz DC-20 GHz DC-20 GHz DC-20 GHz DC-20 GHz 2 GHz 10 GHz 20 GHz 10% to 90% RF 90% to 10% RF 50% DC to 90% RF 50% DC to 10% RF
MIN
-0.6 -0.75 -0.9 -1.05 -1.25 - - - - 26 25 22 - - - -
TYP
-0.42 -0.55 -0.7 -0.8 -1.0 -50 -21 -23 -11 28 27 24 17 42 27 53
MAX
- - - - - -43 -17 -17 -9 - - - - - - -
UNITS
dB dB dB dB dB dB dB dB dB dBm dBm dBm ns ns ns ns
Insertion Loss
Isolation Input Return Loss (ON state) Output Return Loss (ON state) Output Return Loss (OFF state) P1dB
Switching speed
Note 1: TAMBIENT = 25C, Vctrl = 0V/-5V Note 2 : Specifications based on on-wafer measurements 1
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMS2023
Pre-Production Datasheet v3.0
ABSOLUTE MAXIMUM RATINGS:
PARAMETER
Max Input Power Operating Temp Storage Temp
TRUTH TABLE:
CONTROL LINE V1
-5V 0V
SYMBOL
Pin Toper Tstor
ABSOLUTE MAXIMUM
+27dBm -40C to +85C -55C to +150C
RF PATH RFIN-RFO
On (Low Loss) Off (Isolation)
V2
0V -5V
Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the device.
Note: -5V 0.2V; 0V 0.2V
PAD LAYOUT:
PAD NAME
RFIN RFO V1 V2
DESCRIPTION
RFIN RFOUT V1 V2
PIN COORDINATES (m)
141,587 1789,587 901,161 1101,161
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of bond pad opening
DIE SIZE (m)
1910 x 1110
DIE THICKNESS (m)
100
MIN. BOND PAD PITCH (m)
150
MIN. BOND PAD OPENING (m x m )
116 x 116
2
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMS2023
Pre-Production Datasheet v3.0
TYPICAL PERFORMANCE FOR ON-WAFER MEASUREMENTS:
Note: Measurement Conditions VCTRL= -5V (low) & 0V (high), TAMBIENT = 25 C unless otherwise stated
Insertion Loss (S21 ON) 0.00 -0.20 S21 (dB) S21 (dB) -0.40 -0.60 -0.80 -1.00 -1.20 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) 0.00 -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Isolation (S21 OFF)
Input Return Loss (S11 ON) 0.00 -5.00 S11 (dB)
S11 (dB) 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 -35.00 -40.00 -45.00
Output Return Loss (S22 ON)
-10.00 -15.00 -20.00 -25.00 -30.00 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
0
2
4
6
8
10
12
14
16
18
20
Frequency (GHz)
Absorptive Output Return Loss (S22 OFF) 0.00
28.00
P1dB
-5.00
P1dB (dBm)
24.00 20.00 16.00 12.00 8.00
S11 (dB)
-10.00 -15.00 -20.00 -25.00 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
4.00 0.00 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
3
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMS2023
Pre-Production Datasheet v3.0
TYPICAL PERFORMANCE FOR ON-WAFER MEASUREMENTS OVER TEMPERATURE:
Note: Measurement Conditions VCTRL= -5V (low) & 0V (high)
TAMBIENT = 25C
TCOLD = -40C
THOT = +85C
Insertion Loss (S21 ON) 0.00 -0.20 S21 (dB) -0.40 -0.60 -0.80 -1.00 -1.20 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
Isolation (S21 OFF) 0.00 -10.00 -20.00 S21 (dB) -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
Input Return Loss (S11 ON) 0.00 -5.00 S11 (dB) -10.00
Output Return Loss (S22 ON) 0.00 -5.00 -10.00 S22 (dB) -15.00 -20.00 -25.00 -30.00 -35.00 -40.00 -45.00
-15.00 -20.00 -25.00 -30.00 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
0
2
4
6
8
10
12
14
16
18
20
Frequency (GHz)
Absorptive Output Return Loss (S22 OFF) 0.00 -5.00 -10.00 -15.00 -20.00
P1dB
28.00 24.00 P1dB (dBm)
0 2 4 6 8 10 12 14 16 18 20
S22 (dB)
20.00 16.00 12.00 8.00 4.00
-25.00 Frequency (GHz)
0.00 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
4
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMS2023
Pre-Production Datasheet v3.0
PREFERRED ASSEMBLY INSTRUCTIONS:
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is metallised and the recommended mounting method is by the use of conductive epoxy. Epoxy should be applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy on to the top face of the die and ideally should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended and for manual dispense Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150C for one hour in an oven especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. Eutectic die attach is not recommended. This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4m diameter gold wire be used. Thermosonic ball bonding is preferred. A nominal stage temperature of 150C and a bonding force of 40g has been shown to give effective results for 25m wire. Ultrasonic energy shall be kept to a minimum. For this bonding technique, stage temperature should not be raised above 200C and bond force should not be raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires should be minimised especially when making RF or ground connections.
HANDLING PRECAUTIONS:
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (250-500 V) as defined in JEDEC Standard No. 22-A114. Further information on ESD control measures can be found in MIL-STD1686 and MIL-HDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including Sparameters are available on request.
DISCLAIMERS:
This product is not designed for use in any space based or life sustaining/supporting equipment.
ORDERING INFORMATION:
PART NUMBER
FMS2023-000-WP
DESCRIPTION
Die in Waffle-pack (Gel-pak available on request)
5
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com

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